Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Bondable anodized aluminum heatspreader for semiconductor packages

Bondable anodized aluminum heatspreader for semiconductor packages

US Patent 6297550 · Granted Oct 2, 2001

Estimated economic value: $27,811,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

3D-interconnect2025
Method of forming a region shielding within a package of a microelectronic devic2025
3D-interconnect with electromagnetic interference (“EMI”) shield and/or antenna2024
Region shielding within a package of a microelectronic device2024
3D-interconnect2024
3D-interconnect2024
3D-interconnect2021
3D-interconnect2021
3D-interconnect2019
3D-interconnect2019
Low cost hybrid high density package2018
Low cost hybrid high density package2016