Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method for handling and masking a substrate in a sputter deposition system

System and method for handling and masking a substrate in a sputter deposition system

US Patent 6264804 · Granted Jul 24, 2001

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Three-dimensional printer components2025
3D microscope including insertable components to provide multiple imaging and me2025
3D microscope including insertable components to provide multiple imaging and me2022
3D microscope including insertable components to provide multiple imaging and me2022
3D microscope including insertable components to provide multiple imaging and me2021
Three-dimensional printing and three-dimensional printers2019
3D microscope and methods of measuring patterned substrates2019
Optical measurement of opening dimensions in a wafer2018
3D microscope including insertable components to provide multiple imaging and me2018
Method and apparatuses for operating and repairing nuclear reactors2018
Multi-surface optical 3D microscope2017
Multi-surface optical 3D microscope2017