Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming a delamination resistant multi-layer dielectric layer for passivating a conductor layer

Method for forming a delamination resistant multi-layer dielectric layer for passivating a conductor layer

US Patent 6245666 · Granted Jun 12, 2001

Estimated economic value: $2,096,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and structure for nitrogen-doped shallow-trench isolation dielectric2016
Method and apparatus for dynamic plasma treatment of bipolar ESC system2009
Flash process for stacking poly etching2005
Method of improving device performance2005
Method for forming DRAM stacked capacitor1999
Method for edge profile and design rules control1999
Plasma etch method for forming residue free fluorine containing plasma etched la1999
Method to prevent oxide peeling induced by sog etchback on the wafer edge1998