Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for improving wafer topography to provide more accurate transfer of interconnect patterns

Method for improving wafer topography to provide more accurate transfer of interconnect patterns

US Patent 6214722 · Granted Apr 10, 2001

Estimated economic value: $990,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for producing a polyester film2025
Structure and formation method of semiconductor device with epitaxial structures2025
Semiconductor device structure with gate stack and method for forming the same2025
Semiconductor structure2025
Semiconductor device and method of forming same2024
Semiconductor device and method2024
SRAM speed and margin optimization via spacer tuning2024
Transistors with multiple threshold voltages2024
Multi-gate device fabrication and structures thereof2024
Installing module2024
Matte film for hot pressing and manufacturing method thereof2024
Semiconductor device and method of forming same2023