Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Photosensitive resin composition, and multilayer printed circuit board using the same

Photosensitive resin composition, and multilayer printed circuit board using the same

US Patent 6190834 · Granted Feb 20, 2001

Estimated economic value: $336,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Toner2025
Toner2025
Resin composition for protective layer of electromagnetic wave-shielding film, e2025
Laminates and liquid packaging bags2025
Particle, particle for agglutination method, and reagent, kit and detection meth2024
Non-transitory computer-readable storage medium and control device for condition2024
Electromagnetic wave shielding film2023
Composite skin material for vehicle and method for manufacturing the same2023
Motion analysis device, motion analysis method for improving motions of operator2023
Bioelectrode and method for producing bioelectrode2022
TFT module, scanned antenna provided with TFT module, method for driving device 2022
Curable dental composite2022