Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stack arrangement for two semiconductor memory chips and printed board for accepting a plurality of such stack arrangements

Stack arrangement for two semiconductor memory chips and printed board for accepting a plurality of such stack arrangements

US Patent 6157541 · Granted Dec 5, 2000

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible wiring for the transformation of a substrate with edge contacts into a 2003
Method for transforming a substrate with edge contacts into a ball grid array2001
Manufacture of fine structures for semiconductor contacting1989
Process for the production of printed circuits with solder rejecting sub-zones1981
Intermediate member for mounting and contacting a semiconductor body1980