Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of adhering a wafer to a wafer tape

Method of adhering a wafer to a wafer tape

US Patent 6129811 · Granted Oct 10, 2000

Estimated economic value: $67,086,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Adhesive-sealed window lid for micromechanical devices2004
Method and apparatus for stretching and processing saw film tape after breaking 2004
Method of adhering a wafer to wafer tape2002
Method of adhering a wafer to wafer tape2002
Method of breaking and separating a wafer into die using a multi-radii dome2001
Method of breaking and separating a wafer into die using a multi-radii dome2001
Method and apparatus for breaking and separating a wafer into die using a multi-2001
Method and apparatus for breaking and separating a wafer into die using a multi-2001
Gasket sealed integrated circuit package2000
Noncontact method of adhering a wafer to a wafer tape1999
Separation of wafer into die with wafer-level processing1997
Baffled collet for vacuum pick-up of a semiconductor die1996