Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for manufacturing resin-molded semiconductor device

Method for manufacturing resin-molded semiconductor device

US Patent 6126885 · Granted Oct 3, 2000

Estimated economic value: $312,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Light-emitting device2023
Photoalignment composition for the stabilization of the pre-tilt angle in liquid2023
Light emitting device and backlight including the light emitting device2022
Light-emitting device2022
Light-emitting device and backlight including light-emitting device2022
Ventilator-equipped engine2022
Spark ignition engine2022
Information processing apparatus, program, and information processing system2022
Electrolytic capacitor2022
Distance measuring apparatus, distance measuring method, and non-transitory comp2021
Electrolytic capacitor2021
Display device and head-mounted display2021