Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming a circuitry isolation region within a semiconductive wafer

Method of forming a circuitry isolation region within a semiconductive wafer

US Patent 6100162 · Granted Aug 8, 2000

Estimated economic value: $31,220,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor components and semiconductor structures and methods of fabrication2025
Method for making light emitting device (LED) arrays and electronic products usi2025
Method of making a packaged device2025
Light emitting diode (LED) structure having single epitaxial structure separated2025
Method for making electronic device arrays using a temporary substrate2025
Method for fabricating (LED) dice using semiconductor structures on a substrate 2024
Method for fabricating (LED) dice using laser lift-off from a substrate to a rec2024
Method of forming retaining ring with shaped surface2023
Method for making electronic device arrays using a temporary substrate and a car2023
Single light emitting diode (LED) structure having epitaxial structure separated2023
Retaining ring with shaped surface and method of forming2023
Method for fabricating (LED) dice using laser lift-off from a substrate to a rec2022