Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Merging dummy structure representations for improved distribution of artifacts in a semiconductor layer

Merging dummy structure representations for improved distribution of artifacts in a semiconductor layer

US Patent 6081272 · Granted Jun 27, 2000

Estimated economic value: $298,468,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Gyroscope and angle measurement method2022
Antioxidant-containing foamable resin particles, method for producing same, foam2021
Polish to remove topography in sacrificial gate layer prior to gate patterning2012
Carbon nanotube fuse element2010
Unidirectionally conductive materials for interconnection2008
Unidirectionally conductive materials for interconnection2006
Thermally coupling electrically decoupling cooling device for integrated circuit2003
Thermally coupling electrically decoupling cooling device for integrated circuit2003
Guard wall to reduce delamination effects within a semiconductor die1999
Polysilicon polish for patterning improvement1999
Elimination of pad conditioning in a chemical mechanical polishing process1997
Method of forming a guard wall to reduce delamination effects1993