Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Micro grid array solder interconnection structure for second level packaging joining a module and printed circuit board

Micro grid array solder interconnection structure for second level packaging joining a module and printed circuit board

US Patent 6059173 · Granted May 9, 2000

Estimated economic value: $23,540,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Universal tool for uniformly applying a force to a plurality of components on a 2006
Method and system for determining component dimensional information2003
Method and composition for mounting an electronic component and device formed th2003
Method and composition for mounting an electronic component and device formed th2003
Surface mount technology with masked cure2003
Transfer fluxing method and apparatus for component placement on substrate2002
Method and apparatus for micro BGA removal and reattach2002
Method and apparatus for micro BGA removal and reattach2002
Method and apparatus for micro BGA removal and reattach2002
Micro grid array solder interconnection structure with solder columns for second2002
Micro grid array solder interconnection structure with solder columns for second2002
Micro grid array solder interconnection structure with solder columns for second2002