Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Heterojunction bipolar transistor having improved heat dissipation

Heterojunction bipolar transistor having improved heat dissipation

US Patent 6051871 · Granted Apr 18, 2000

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Embedded organic interposer for high bandwidth2025
Bonded structure including an obstructive element directly bonded to a semicondu2025
Protective elements for bonded structures2025
Circuitry for electrical redundancy in bonded structures2025
3D processor having stacked integrated circuit die2025
Communication method and apparatus to improve a random access success rate of a 2025
Direct-bonded native interconnects and active base die2025
Circuitry for electrical redundancy in bonded structures2025
3D memory circuit2025
3D chip sharing data bus2025
Apparatus for non-volatile random access memory stacks2025
Symbiotic network on layers2025