Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wire bonding methods and apparatus for heat sensitive metallization using a thermally insulated support portion

Wire bonding methods and apparatus for heat sensitive metallization using a thermally insulated support portion

US Patent 6031216 · Granted Feb 29, 2000

Estimated economic value: $43,143,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Federated systems and methods for medical data sharing2024
Federated systems and methods for medical data sharing2022
Chip package having a cover with window2021
USB to coax bridge2021
Die singulation and stacked device structures2021
S-nitrosoglutathione (GSNO) and GSNO reductase inhibitors for use in therapy2021
Stacked silicon package assembly having enhanced stiffener2020
Chip package assembly with composite stiffener2020
Federated systems and methods for medical data sharing2020
Chip package assembly with surface mounted component protection2019
Parameterized quality of service architecture in a network2019
USB to Coax Bridge2019