Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer

Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer

US Patent 6020262 · Granted Feb 1, 2000

Estimated economic value: $24,099,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for using a streaming protocol2017
System and method for using a streaming protocol2015
System and method for using a streaming protocol2014
System and method for using a streaming protocol2012
Automatic adaptive equalization method for high-speed serial transmission link2010
System and method for using a streaming protocol2010
Networked port-inventory system and method2010
System and method of digitally testing an analog driver circuit2010
System and method for using a streaming protocol2009
System of digitally testing an analog driver circuit2008
Data transceiver and method for equalizing the data eye of a differential input 2008
Method of monitoring introduction of interfacial species2008