Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chemical-mechanical polish (CMP) pad conditioner

Chemical-mechanical polish (CMP) pad conditioner

US Patent 5985093 · Granted Nov 16, 1999

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sidewall protection for a via hole formed in a photosensitive, low dielectric co2001
Method to improve the roughness of metal deposition on low-k material2001
Plasma treatment to improve DUV photoresist process2001
Sequential oxygen plasma treatment and chemical mechanical polish (CMP) planariz1999
Temperature compensated chemical mechanical polishing to achieve uniform removal1999
Method of planarizing wafers with shallow trench isolation1999
Method for fabricating intermetal dielectric insulation using anisotropic plasma1999
Chemical-mechanical polishing planarization monitor1998
In situ method for CMP endpoint detection1998
Chemical-mechanical polish (CMP) pad conditioner1998
Method and apparatus for forming very small scale Cu interconnect metallurgy on 1998
Teos plasma protection technology1997