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Home › Tester arrangement comprising a connection module for testing, by way of the boundary scan test method, a carrier provided with a first number of digital ICS with BST logic and a second number of digital ICS without BST logic

Tester arrangement comprising a connection module for testing, by way of the boundary scan test method, a carrier provided with a first number of digital ICS with BST logic and a second number of digital ICS without BST logic

US Patent 5978945 · Granted Nov 2, 1999

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