Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › IC package having a single wiring sheet with a lead pattern disposed thereon

IC package having a single wiring sheet with a lead pattern disposed thereon

US Patent 5973395 · Granted Oct 26, 1999

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High-frequency signal transmission device and electrical connection method for w2025
Substrate processing apparatus, substrate processing method, method of manufactu2025
High-frequency signal transmission device and high-frequency signal transmission2025
Charged particle beam apparatus and contamination removal method therefor2008
Electron beam apparatus2005
Electromagnetic field superimposed lens and electron beam device using this elec2005
Electron beam apparatus2004
Scanning electronic beam apparatus2003
Electron beam apparatus2003
Tape transfer device2002
Contact structure of lead2002
Resistor array board2002