Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6243946 | Method of forming an interlayer connection structure | Etsuji Suzuki, Akira Yonezawa | 2001-06-12 |
| 5973395 | IC package having a single wiring sheet with a lead pattern disposed thereon | Etsuji Suzuki, Akira Yonezawa, Hiroshi Odaira | 1999-10-26 |
| 5950306 | Circuit board | Etsuji Suzuki, Akira Yonezawa | 1999-09-14 |