Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for mounting a very large scale integration (VLSI) chip package to a computer chasis for cooling

Method and apparatus for mounting a very large scale integration (VLSI) chip package to a computer chasis for cooling

US Patent 5969944 · Granted Oct 19, 1999

Estimated economic value: $212,976,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Processing unit employing micro-operations (micro-ops) random access memory (RAM2025
Using intrinsic chip behaviors to generate physically unclonable functions (PUFs2024
Emulating scratchpad functionality using caches in processor-based devices2023
Scalable polylithic on-package integratable apparatus and method2023
Marine drives and cooling systems for marine drives having a crankcase cooler2022
Transportation vehicle with ultrawideband communication2022
In-line memory module (IMM) computing node with an embedded processor(s) to supp2021
Memory system supporting programmable selective access to subsets of parallel-ar2021
Providing flexible matrix processors for performing neural network convolution i2021
Electrodynamic converter2020
Providing efficient floating-point operations using matrix processors in process2020
Providing efficient multiplication of sparse matrices in matrix-processor-based 2020