Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Grinding process and apparatus for planarizing sawed wafers

Grinding process and apparatus for planarizing sawed wafers

US Patent 5964646 · Granted Oct 12, 1999

Estimated economic value: $1,332,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and systems for use in grind spindle alignment2017
Systems and methods of processing substrates2016
Method of grinding wafer stacks to provide uniform residual silicon thickness2015
Systems and methods of wafer grinding2015
Method, apparatus and system for use in processing wafers2013
Grinding apparatus having an extendable wheel mount2012
Grinding apparatus and method2008
Grinding apparatus and method2008
Chuck for supporting wafers with a fluid2007
Wafer carrier pivot mechanism2007
Grinding apparatus and method2006
Grinding apparatus and method2006