Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for producing multi-level metallization in an integrated circuit

Process for producing multi-level metallization in an integrated circuit

US Patent 5956618 · Granted Sep 21, 1999

Estimated economic value: $71,506,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reticle pod with quick-release support mechanism2025
Gas diffusion device, and wafer container including the same2025
Substrate container with built-in negative pressure cavity2025
Substrate container and its door assembly, support assembly, and elastic buffer 2025
Substrate retaining assembly and door device2025
Cooling systems, cooling structures and electronic devices and methods for manuf2025
Front opening unified pod2025
Airlock2025
X-ray reflectometry apparatus and method thereof for measuring three dimensional2025
Substrate container system2024
X-ray reflectometry apparatus and method thereof for measuring three dimensional2024
X-ray reflectometry apparatus and method thereof for measuring three dimensional2023