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Home › Bi-directional cooling arrangement for use with an electronic component enclosure

Bi-directional cooling arrangement for use with an electronic component enclosure

US Patent 5940266 · Granted Aug 17, 1999

Estimated economic value: $20,828,000 ⓘ

Assignee

IBM

Inventors

Roger Duane Hamilton (27 patents)
Sukhvinder S. Kang (29 patents)
Christopher W. Mann (8 patents)

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