Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus for applying an urging force to a wafer

Apparatus for applying an urging force to a wafer

US Patent 5916009 · Granted Jun 29, 1999

Estimated economic value: $4,509,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Pressing apparatus, substrate bonding apparatus and stacked substrate2018
Pressuring module, pressuring apparatus, substrate bonding apparatus, substrate 2016
Wafer bonding apparatus2014
Wafer bonding apparatus2012
Vacuum suction holding apparatus and holding method, polishing apparatus using t2007
Polishing apparatus, method of manufacturing semiconductor device using the same2007
Carriers and polishing apparatus2001
Carrier and polishing apparatus2000
Surface polishing pad2000
Polishing apparatus2000
Workpiece surface processing apparatus2000
Planarization method, workpiece measuring method, and surface planarization appa2000