Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for filling trenches in a semiconductor wafer

Methods for filling trenches in a semiconductor wafer

US Patent 5915190 · Granted Jun 22, 1999

Estimated economic value: $34,682,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and apparatus for sensing unconfinement in a plasma processing chamber2010
Method for providing uniform removal of organic material2009
Apparatus and methods for the detection of an arc in a plasma processing system2008
Method of plasma etching silicon nitride2005
Trench etch process for low-k dielectrics2005
Trench etch process for low-k dielectrics2004
Method of plasma etching of silicon carbide2003
Microwave plasma processor2000
Method for monitoring process endpoints in a plasma chamber and a process monito1998
Chuck for substrate processing and method for depositing a film in a radio frequ1998
Plasma cleaning method for removing residues in a plasma process chamber1997
Window for microwave plasma processing device1993