{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Photosensitive polyimide precursors", "item": "https://www.patentleaderboard.com/patent/5866627"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Photosensitive polyimide precursors

Photosensitive polyimide precursors

US Patent 5866627 · Granted Feb 2, 1999

Estimated economic value: $19,134,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Selectively functionalized porous material2022
Implementing the post-porosity plasma protection (P4) process using I-CVD2022
Surface modification by polymer anchoring on porous substrates2021
Enhanced adhesive materials and processes for 3D applications2021
Enhanced adhesive materials and processes for 3D applications2020
Selectively functionalized porous material2019
Surface modification by polymer anchoring on porous substrates2019
Enhanced via fill material and processing for dual damscene integration2019
Articles including ultra low dielectric layers2019
Enhanced adhesive materials and processes for 3D applications2018
Method of manufacturing an ultra low dielectric layer2017
Determination of young'S modulus of porous thin films using ultra-low load nano-2017