Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for jetting, manufacturing and attaching uniform solder balls

Method and apparatus for jetting, manufacturing and attaching uniform solder balls

US Patent 5855323 · Granted Jan 5, 1999

Estimated economic value: $58,777,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Differential pressure sensor assembly2017
Environmental sensor structure2017
Electronic devices with cavity-type, permeable material filled packages, and met2016
Die-to-die inductive communication devices and methods2016
Lead frame having a flag with in-plane and out-of-plane mold locking features2014
Redistributed chip packaging with thermal contact to device backside2012
Method of making an integrated circuit package with shielding via ring structure2012
Integrated conformal shielding method and process using redistributed chip packa2011
Method for forming a packaged semiconductor device2010
Integrated circuit module with integrated passive device2010
Electromagnetic shield formation for integrated circuit die package2010
Semiconductor component comprising leadframe, semiconductor chip and integrated 2006