Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Low-profile microelectronic package

Low-profile microelectronic package

US Patent 5844315 · Granted Dec 1, 1998

Estimated economic value: $24,331,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Display and solar cell device2007
Brain response monitoring apparatus and method2004
Eye implant for treating glaucoma and method for manufacturing same2004
Microelectronic package comprising tin copper solder bump interconnections and m2002
Remotely interrogated biomedical sensor2001
Low-profile microelectronic package2001
Low-profile microelectronic package2001
Low-profile microelectronic package2001
Microelectronic package including a polymer encapsulated die2000
Microelectronic assembly including an antenna element embedded within a polymeri2000
Microelectronic module having optical and electrical interconnects1999
Microelectronic package including a polymer encapsulated die, and method for for1999