Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Post-lapping cleaning process for silicon wafers

Post-lapping cleaning process for silicon wafers

US Patent 5837662 · Granted Nov 17, 1998

Estimated economic value: $7,030,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of manufacturing a semiconductor on insulator structure by a pressurized 2023
Methods for preparing a SOI structure2023
Methods for removing an oxide film from a SOI structure and methods for preparin2022
Method of manufacture of a semiconductor on insulator structure2020
Method of manufacture of a semiconductor on insulator structure2019
Methods for producing rectangular seeds for ingot growth2016
Systems for producing silane2016
Methods and systems for grain size evaluation of multi-cystalline solar wafers2015
Methods for producing rectangular seeds for ingot growth2015
Systems for producing silane2015
Methods for producing silane2015
Fluidized bed reactor systems and distributors for use in same2014