Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method to produce known good die using temporary wire bond, die attach and packaging

Method to produce known good die using temporary wire bond, die attach and packaging

US Patent 5836071 · Granted Nov 17, 1998

Estimated economic value: $23,340,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hybrid chip carrier package2025
HIV vaccines and methods of using2024
HIV vaccines and methods of making and using2023
Rod railing anchor2020
Tension rod anchors and railings2020
Method and device for simulating network resiliance against attacks2018
Systems and methods for identifying associations between malware samples2017
Apparatus with disc separator plates2016
Adaptor implementation for internet protocol address and port hopping2016
Systems and methods for identifying associations between malware samples2016
Plastic critical tolerance fit component2016
Systems and methods for identifying associations between malware samples2014