Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for the creation of a thermal SiO.sub.2 layer with extremely uniform layer thickness

Process for the creation of a thermal SiO.sub.2 layer with extremely uniform layer thickness

US Patent 5817581 · Granted Oct 6, 1998

Estimated economic value: $15,994,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Humanised anti-n-truncated amyloid β monoclonal antibody2025
Coaxial transmission with plain bearing2025
Vehicle crane system having an attachment part transporting unit for a bracing d2023
Coaxial gear mechanism2023
Coaxial transmission2023
Coaxial gear mechanism2023
Bolt type angular gear mechanism2022
Vehicle crane system for transporting an attachment part, in particular a main j2022
Modular crane, transport unit for a modular crane and method for operating a cra2020
Interruption facility for adjunct processor queues2020
Transmission2020
Distributed measurement arrangement for an embedded automotive acquisition devic2019