Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for attaching a silicon chip to a circuit board using a block of encapsulated wires and the block of wires manufactured by the process

Process for attaching a silicon chip to a circuit board using a block of encapsulated wires and the block of wires manufactured by the process

US Patent 5807766 · Granted Sep 15, 1998

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Structure including a partially electrochemically reduced halogenated polymeric 1999
Direct attachment of silicon chip to circuit carrier1998
Method for conditioning halogenated polymeric materials and structures fabricate1998
Method for conditioning halogenated polymeric materials and structures fabricate1998
Method for treating substrates1995
Method for conditioning halogenated polymeric materials and structures fabricate1994
Fluid treatment device1994
Method of marking a thin film package1992
Flexible carrier for an electronic device1991
Thin film package for mixed bonding of chips1990
Flexible carrier for an electronic device1990
Organic solder barrier1990