Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of making an interface layer for stacked lamination sizing and sintering

Method of making an interface layer for stacked lamination sizing and sintering

US Patent 5800761 · Granted Sep 1, 1998

Estimated economic value: $8,247,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Lab scanner2025
Brine without phosphates and either salt free or low salt2025
Electronic device console with natural draft cooling2023
Mitigating moisture-driven degradation of features designed to prevent structura2023
Polygon integrated circuit (IC) packaging2022
Direct bonded heterogeneous integration packaging structures2021
Fins for enhanced die communication2021
System and method for aggregating and analyzing financial data2021
Mitigating moisture-driven degradation of features designed to prevent structura2021
Electronic device console with natural draft cooling2020
Direct bonded heterogeneous integration packaging structures2020
Under die surface mounted electrical elements2017