Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming a buried contact on a semiconductor substrate

Method for forming a buried contact on a semiconductor substrate

US Patent 5798295 · Granted Aug 25, 1998

Estimated economic value: $10,159,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wide-format tile shim2024
Furnace2024
Low power memory state retention regulator2022
System and method of analyzing integrated circuit in consideration of a process 2022
Switch control circuit for a power switch with electrostatic discharge (ESD) pro2021
Power rail for standard cell block2020
Power grid and standard cell co-design structure and methods thereof2020
Furnace2020
Circuit with multiple voltage scaling power switches2019
Voltage regulator2019
Integrated circuit including cells/gates arranged based on supply voltage variat2019
Method of resolving color conflicts for cell-based designs with multi-pattern li2019