Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Surface mount peripheral leaded and ball grid array package

Surface mount peripheral leaded and ball grid array package

US Patent 5789811 · Granted Aug 4, 1998

Estimated economic value: $4,833,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

3D-interconnect2025
Method of forming a region shielding within a package of a microelectronic devic2025
3D-interconnect with electromagnetic interference (“EMI”) shield and/or antenna2024
Region shielding within a package of a microelectronic device2024
3D-interconnect2024
3D-interconnect2024
3D-interconnect2021
3D-interconnect2021
3D-interconnect2019
3D-interconnect2019
Low cost hybrid high density package2018
Low cost hybrid high density package2016