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Home › Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size

Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size

US Patent 5781412 · Granted Jul 14, 1998

Estimated economic value: $6,657,000 ⓘ

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