Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Conformal thermal interface material for electronic components

Conformal thermal interface material for electronic components

US Patent 6054198 · Granted Apr 25, 2000

Estimated economic value: $25,138,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thermal interface material2021
Deflectable conductive gasket with environmental seal2017
Electrode assembly for delivering a therapeutic agent into ocular tissue2014
Encapsulated expanded crimped metal mesh for sealing and EMI shielding applicati2014
Encapsulated expanded crimped metal mesh for sealing, EMI shielding and lightnin2014
Low force deflection and corrosion resistant EMI gasket2014
Dispensable cured resin2012
Reactive foil assembly2011
Conformal thermal interface material for electronic components2010
Thermal management materials having a phase change dispersion2010
Thermally or electrically-conductive form-in-place gap filter2007
Thermally or electrically-conductive form-in-place gap filter2007