Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hole generation and lead forming for integrated circuit lead frames using laser machining

Hole generation and lead forming for integrated circuit lead frames using laser machining

US Patent 5767480 · Granted Jun 16, 1998

Estimated economic value: $3,266,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Using a requestor identity to enforce a security policy on a network connection 2025
Security for computer systems2025
Stackable package and method2024
Device for deformational processing of materials (variants)2020
Device for extruding plasticized masses and plastic powdered materials2019
Stackable package and method2016
Floating plane touch detection system2013
Stackable package and method2013
Semiconductor package with fast power-up cycle and method of making same2011
Stacked electronic component package having film-on-wire spacer2011
Stacked flip chip die assembly2010
Semiconductor package with fast power-up cycle and method of making same2010