Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for testing a ball grid array semiconductor device and a device for such testing

Method for testing a ball grid array semiconductor device and a device for such testing

US Patent 5731709 · Granted Mar 24, 1998

Estimated economic value: $10,021,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fiber optic switch package and a method of assembling a fiber optic switch packa2003
Fiber optic switch package and method of assembling a fiber optic switch package2003
Method for improved die release of a semiconductor device from a wafer2003
Fiber optic switch package and a method of assembling a fiber optic switch packa2002
Method for plating using nested plating buses and semiconductor device having th2000
Method for plating using nested plating buses and semiconductor device having th2000
Method for making an electronic component having an organic substrate1997
Method for making an electronic component having an organic substrate1997
Self-opening vent hole in an overmolded semiconductor device1997
Method for making semiconductor device having no die supporting surface1995
Method for making semiconductor device having no die supporting surface1995
Method for plating using nested plating buses and semiconductor device having th1995