Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE36773 | Method for plating using nested plating buses and semiconductor device having the same | Victor K. Nomi, Twila J. Reeves | 2000-07-11 |
| 5731709 | Method for testing a ball grid array semiconductor device and a device for such testing | Victor K. Nomi, Howard P. Wilson | 1998-03-24 |
| 5691242 | Method for making an electronic component having an organic substrate | Victor K. Nomi, Charles G. Bigler | 1997-11-25 |
| 5474958 | Method for making semiconductor device having no die supporting surface | Frank Djennas, Victor K. Nomi, Twila J. Reeves, Les Postlethwait | 1995-12-12 |
| 5467252 | Method for plating using nested plating buses and semiconductor device having the same | Victor K. Nomi, Twila J. Reeves | 1995-11-14 |
| 5287962 | Vacuum seal indicator for flexible packaging material | Victor K. Nomi | 1994-02-22 |
| 5285352 | Pad array semiconductor device with thermal conductor and process for making the same | Victor K. Nomi, Howard P. Wilson | 1994-02-08 |