Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process for making copper metal powder, copper oxides and copper foil

Process for making copper metal powder, copper oxides and copper foil

US Patent 5670033 · Granted Sep 23, 1997

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus for controlling flow in an electrodeposition process2008
Data processing system having translation lookaside buffer valid bits with lock 2007
Interrupt processing in a data processing system2005
Apparatus for controlling flow in an electrodeposition process2005
Anode for plating a semiconductor wafer2003
Method and apparatus for controlling flow in an electrodeposition process2002
Electroforming cell2002
Low density high surface area copper powder and electrodeposition process for ma2001
Low density high surface area copper powder and electrodeposition process for ma2001
Low density high surface area copper powder and electrodeposition process for ma2001
Method and apparatus for sequentially metalizing polymeric films and products ma2001
Method and apparatus for sequentially metalizing polymeric films and products ma2001