Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for controlling flow in an electrodeposition process

Method and apparatus for controlling flow in an electrodeposition process

US Patent 6398939 · Granted Jun 4, 2002

Estimated economic value: $25,519,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus for controlling flow in an electrodeposition process2008
Apparatus for controlling flow in an electrodeposition process2008
Apparatus for controlling flow in an electrodeposition process2005
Apparatus for controlling flow in an electrodeposition process2005
Electroforming cell2002
Method and apparatus for sequentially metalizing polymeric films and products ma2001
Process for making copper wire2001
Method and apparatus for sequentially metalizing polymeric films and products ma1999
Method and apparatus for sequentially metalizing polymeric films and products ma1998
Method and apparatus for sequentially metalized polymeric films and products mad1997
Method for forming printed circuits1997
Process for making wire1997