Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array

Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array

US Patent 5639696 · Granted Jun 17, 1997

Estimated economic value: $9,146,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power adaption device2025
Rotary coupling structure, power supply device and sofa2022
Interrelated entertainment devices for music and related information2021
Power adapter2020
Power adapter2020
Switch power circuit with backup battery for power supply2019
Methods of packaging an integrated circuit and methods of forming an integrated 2011
Integrated circuit package, ball-grid array integrated circuit package2011
Integrated circuit package, ball-grid array integrated circuit package2003
Integrated circuit device with integral decoupling capacitor2001
Methods of packaging an integrated circuit and methods of forming an integrated 2001
Interposer for ball grid array (BGA) package1999