Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of packing an IC die in a molded plastic employing an ultra-thin die coating process

Method of packing an IC die in a molded plastic employing an ultra-thin die coating process

US Patent 5525839 · Granted Jun 11, 1996

Estimated economic value: $5,371,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic component structure and method of making2011
Embedding an electronic component between surfaces of a printed circuit board2010
Die pad crack absorption system and method for integrated circuit chip fabricati2003
Staggered pad array2000
Composite metallization structures for improved post bonding reliability2000
Universal test die and method for fine pad pitch designs1997
Electrically and thermally enhanced package using a separate silicon substrate1997
Multi-purpose bond pad test die1992