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Home › Semiconductor IC device having a RAM interposed between different logic sections and by-pass signal lines extending over the RAM for mutually connecting the logic sections

Semiconductor IC device having a RAM interposed between different logic sections and by-pass signal lines extending over the RAM for mutually connecting the logic sections

US Patent 5477067 · Granted Dec 19, 1995

Estimated economic value: $167,000 ⓘ

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