Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Metal interconnect fabrication with dual plasma silicon dioxide deposition and etchback

Metal interconnect fabrication with dual plasma silicon dioxide deposition and etchback

US Patent 5472825 · Granted Dec 5, 1995

Estimated economic value: $5,193,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus and method for cleaning a wafer2004
Apparatus for coating a workpiece with fluid contamination detection1998
Optical-fiber liquid-level monitor1998
Magnetic sensing robotics for automated semiconductor wafer processing systems1997
Fusion heat sink for integrated circuit1997
Method for detecting contaminants carried by a fluid1996
Apparatus and method for detecting contaminants carried by a fluid1996
Fusion heat sink for integrated circuit1995
Semiconductor wafer defect monitoring1995
Integrated circuit package including a heat pipe1994
Contaminant monitor for a flowing liquid1994
Electro-optic monitor for fluid spray pattern1994