Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic package with lead wire connections and method of making same

Electronic package with lead wire connections and method of making same

US Patent 5470796 · Granted Nov 28, 1995

Estimated economic value: $7,904,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Turning behavior control device for vehicle2025
Sewing management system2025
Via for electrical contact passing through layers of optical waveguide in multil2017
Via for electrical contact passing through layers of optical waveguide in multil2016
Spacer resin pattern helping to reduce optical coupling loss in optical waveguid2015
Circuit board and mounting structure2013
Smectic aerogel and method for production thereof2012
Circuit board, mounting structure, and method for manufacturing circuit board2012
Resin film, adhesive sheet, circuit board, and electronic apparatus2012
Optical waveguide member, optical wiring board, optical wiring module and method2011
CATV tuner and one-chip IC used therein2009
Printed circuit board and electronic package using same2006