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Home › Lead frame material formed of copper alloy for resin sealed type semiconductor devices

Lead frame material formed of copper alloy for resin sealed type semiconductor devices

US Patent 5463247 · Granted Oct 31, 1995

Assignee

Mitsubishi Shindoh Co.

Inventors

Rensei Futatsuka (9 patents)
Shunichi Chiba (13 patents)
Junichi Kumagai (9 patents)

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