Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5997810 | High-strength copper based alloy free from smutting during pretreatment for plating | Junichi Kumagai, Shunichi Chiba | 1999-12-07 |
| 5885376 | Corrosion-resistant high-strength copper based alloy having excellent blankability | Takeshi Suzuki, Manpei Kuwahara, Shin Kikuchi, Yoshiharu Mae, Junichi Kumagai +1 more | 1999-03-23 |
| 5667752 | Copper alloy sheet for connectors and connectors formed of same | Takeshi Suzuki, Manpei Kuwahara, Seiji Kumagai | 1997-09-16 |
| 5510197 | Lead frame material and lead frame for semiconductor device | Shunji Takahashi, Seizo Masukawa, Tetsuya Sugimoto, Takeshi Suzuki, Chuzo Azuma +2 more | 1996-04-23 |
| 5463247 | Lead frame material formed of copper alloy for resin sealed type semiconductor devices | Shunichi Chiba, Junichi Kumagai | 1995-10-31 |
| 4877577 | Copper alloy lead frame material for semiconductor devices | Synu-ichi Chiba, Tadao Sakakibara | 1989-10-31 |
| 4750029 | Copper base lead material for leads of semiconductor devices | Tadao Sakakibara, Shunichi Chiba | 1988-06-07 |
| 4668471 | Copper alloy lead material for leads of a semiconductor device | Seiji Kumagai, Masuhiro Izumida | 1987-05-26 |
| 4249941 | Copper base alloy for leads of integrated circuit | Tadao Sakakibara | 1981-02-10 |