Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit package having a liquid metal-aluminum/copper joint

Integrated circuit package having a liquid metal-aluminum/copper joint

US Patent 5459352 · Granted Oct 17, 1995

Estimated economic value: $4,949,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fast spectrum molten chloride test reactors2023
Direct heat exchanger for molten chloride fast reactor2021
Containers for liquid nitrogen storage of semen straws2019
Method of extending the operational period of a heat-exchanger in a chip tester2006
Method of regulating the temperature of integrated circuit modules, using a heat2004
Method of fabricating a heat exchanger, for regulating the temperature of multip2003
Method of fabricating an alloy film on a face of a heat exchanger for an integra2003
Mechanical assembly for fabricating an alloy film on a face of a heat exchanger 2002
Dual processor retention assembly2002
Method of fabricating an integrated circuit package having a liquid metal-alumin1997
Method of fabricating an integrated circuit package having a liquid metal-alumin1997
Method of fabricating an integrated circuit package having a liquid metal-alumin1997