Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of regulating the temperature of integrated circuit modules, using a heat exchanger with a face of a solid malleable metal and a release agent

Method of regulating the temperature of integrated circuit modules, using a heat exchanger with a face of a solid malleable metal and a release agent

US Patent 6822465 · Granted Nov 23, 2004

Estimated economic value: $14,592,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Alignment mechanism2024
Alignment mechanism2024
Integrated circuit testing device with coupled control of thermal system2024
Socket side thermal system2024
Alignment mechanism2023
Alignment mechanism2023
Temperature control system including contactor assembly2023
Assembly and sub-assembly for thermal control of electronic devices2021
Socket side thermal system2020
Leak tolerant liquid cooling system employing improved air purging mechanism2020
Micro-vision alignment system with guiding rings for IC testing2018
System and method for accelerating a device2017